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27.01.2017 Magnetic skyrmion 'brain' connections save energy
Simulations suggest that ultralow-power-consumption magnetic skyrmion devices could mimic the memory and learning functions in neural synapses.
09.12.2013 How to build a memcomputer
Unexpected discovery could lead to the development of computers that resemble the human brain
16.12.2013 Flexible TEG breaks new power record
Thermoelectric generator could be used in mobile phones, laptops, biomedical sensors and other portable devices
02.11.2015 Nanographene broadens memory prospects
High density nanographene based CTM provides a path for future miniaturised memory devices.
14.03.2016 Hot nano-pen writes reconfigurable magnetic nanopatterns
New technique could be used to fabricate a new generation of computing and sensing devices.
29.03.2010 Applied Materials Enables Defect Inspection at 22nm and Below with New UVision 4 System
Applied Materials, Inc. today unveiled its Applied UVision® 4 wafer inspection system, enabling chipmakers to detect yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Extending Applied
12.06.2010 Tegal Corporation Reports Fiscal Fourth Quarter and Full Year 2010 Financial Results
Tegal Corporation (NASDAQ: TGAL), an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced financial results for the fourth quarter and fiscal year 2010, which ended March 31, 2010.
13.08.2010 Tegal Corporation Reports First Quarter Fiscal 2011 Financial Results
Tegal Corporation (NASDAQ:TGAL), an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced financial results for the first quarter of fiscal year 2011, which ended June 30, 2010.
16.08.2010 Microchip Announces Industry’s First 8-bit Microcontroller with 128 KB Flash Memory in 28-pin Package
PIC® MCU Features XLP Technology for eXtreme Low Power Consumption, On-Chip 12-bit ADC and mTouch™ Capacitive Touch-Sensing
08.10.2010 Researchers examine material bonding at the atomic level
An approach pioneered by researchers at North Carolina State University gives scientists new insight into the way silicon bonds with other materials at the atomic level. This technique could lead to improved understanding of and control over bond formation at the atomic level, and opportunities for the creation of new devices and more efficient microchips.